Experience Level: Entry Level | Posted Date: 2025-04-14
At imaging electronics, we use a piezo amplifier (PIPA) designed for driving specific lens elements. This drives a multiplexed called the LAMA. We need to scale down the design we currently have and move the electronics from boards to a box. Using the latest technologies you will investigate the options, use simulations and analog design “protos”, to create a new state of the art front end of this piezo amplifier that performs similar or better than our current PIPA.
Investigate the current use case for the current PIPA. Gather the base specs for a new design especially the required drive capabilities (uF), speed, frequency response, feedback, calibration and parameterization possibilities of the new amplifier design for all lens elements. You will focus on the frontend design of the amplifier, simulate and verify the design and compare this with the existing PIPA designs.
Important aspects are scalability, heat generation and power consumption.
This is a Master internship for 9 to 12 months starting as of September 2025.
To be a perfect fit for this assignment, you:
You have technical knowhow on:
Please add both a cover letter and resume to your application.
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