INTERN, WIRE BOND PROCESS ENGINEER

JOB DESCRIPTION:

• Support Process Improvement Projects: Assist in optimizing the wire bond process through SPC and Yield improvement projects.
• Collaborate with Engineers: Work closely with equipment and process engineers to align the machine and process controls per device group.
• Data Collection and Analysis: Perform data collection, analysis, and report results to support improvement projects and validation efforts.
• Technical Knowledge Development: Gain hands-on experience with wire bond tools and techniques, and learn about the entire assembly process flow.
• Process Optimization: Assist in performing Design of Experiments (DOE), wire bond validation, and assessments.
  
  
   

QUALIFICATION:

• Education: Final year of a degree in Mechanical Engineering, Electrical Engineering, Electronics, Mechatronics, Semiconductor Technology, or a related field.
• Technical Skills: Proficiency in Microsoft Excel and PowerPoint. Knowledge of data analytics and reporting tools.
• Additional Skills: Strong analytical and problem-solving skills. Ability to work collaboratively in a team environment.